EMIF03-SIM02C2 数据手册 ( 数据表 ) - STMicroelectronics

Description
The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip-Chip packaging means the package size is equal to the die size.
This filter includes an ESD protection circuitry which protects the application from damage when subjected to ESD surges up 15 kV.

FEATUREs
■ EMI symmetrical (I/O) low-pass filter
■ high efficiency in EMI filtering
■ lead-free coated package
■ very low PCB space occupation:
   – 1.42 mm x 1.42 mm
■ very thin package: 0.65 mm
■ high efficiency in ESD suppression
■ high reliability offered by monolithic integration
■ high reduction of parasitic elements through integration and wafer level packaging

APPLICATIONs
Where EMI filtering in ESD sensitive equipment is required:
■ SIM Interface (subscriber identify module)
■ UIM Interface (universal identify module)