EMIF03-SIM01F2 数据手册 ( 数据表 ) - STMicroelectronics

Description
The EMIF03-SIM01F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip Chip packaging means the package size is equal to the die size.
This filter includes ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

FEATUREs
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead-free package
■ Very low PCB space occupation:
1.42 mm x 1.42 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through integration and wafer level packaging

APPLICATIONs
EMI filtering and ESD protection for:
■ SIM interface (subscriber identity module)
■ UIM interface (universal identity module)