LTC695C-3.3 查看數據表（PDF） - Linear Technology

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LTC695C-3.3

3.3V Microprocessor Supervisory Circuits

Linear Technology 

LTC694-3.3/LTC695-3.3

PACKAGE DESCRIPTION

SW Package

16-Lead Plastic Small Outline (Wide 0.300)

(Reference LTC DWG # 05-08-1620)

.030 ±.005

TYP

N

.050 BSC .045 ±.005

.398 – .413

(10.109 – 10.490)

NOTE 4

16 15 14 13 12 11 10 9

N

.420

.325 ±.005

MIN

NOTE 3

.394 – .419

(10.007 – 10.643)

123

N/2

RECOMMENDED SOLDER PAD LAYOUT

.005

(0.127)

RAD MIN

.291 – .299

(7.391 – 7.595)

NOTE 4

.010

(0.254

–

–

.029

0.737)

×

45°

0° – 8° TYP

N/2

123 45678

.093 – .104

(2.362 – 2.642)

.037 – .045

(0.940 – 1.143)

.050

.009 – .013

(0.229 – 0.330)

NOTE 3

.016 – .050

(0.406 – 1.270)

NOTE:

1. DIMENSIONS

IN

INCHES

(MILLIMETERS)

(1.270)

BSC .014 – .019

(0.356 – 0.482)

TYP

2. DRAWING NOT TO SCALE

3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.

THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS

4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

.004 – .012

(0.102 – 0.305)

S16 (WIDE) 0502

69453fb

18

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