IXKN40N60C Datasheet - IXYS CORPORATION

Features
● miniBLOC package
   - Electrically isolated copper base
   - Low coupling capacitance to the heatsink for reduced EMI
   - High power dissipation due to AlN ceramic substrate
   - International standard package SOT-227
   - Easy screw assembly
● Fast CoolMOS power MOSFET
   - High blocking capability
   - Low on resistance
   - Avalanche rated for unclamped inductive switching (UIS)
   - Low thermal resistance due to reduced chip thickness
● Enhanced total power density

APPLICATIONs
● Switched mode power supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Power factor correction (PFC)
● Welding
● Inductive heating