
IXYS CORPORATION
CoolMOS Power MOSFET ISOPLUS220™
Electrically Isolated Back Surface
N-Channel Enhancement Mode
Low RDS(on), High Voltage MOSFET
FEATUREs
• Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
• 3RD generation CoolMOS power MOSFET
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped inductive
switching (UIS)
• Low thermal resistance due to reduced
chip thickness
• Low drain to tab capacitance(<30pF)
APPLICATIONs
• Switched Mode Power Supplies (SMPS)
• Uninterruptible Power Supplies (UPS)
• Power Factor Correction (PFC)
• Welding
• Inductive Heating
Advantages
• Easy assembly: no screws or isolation
foils required
• Space savings
• High power density