SK53C 数据手册 ( 数据表 ) - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● Low profile package
● Ideal for automated placement
● Ultrafast reverse recovery time
● Low power losses, high efficiency
● Low forward voltage drop
● High surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC