M14C04_DD 数据手册 ( 数据表 ) - STMicroelectronics

PRODUCT                           M14C04
■ WAFER SIZE                   152 mm (6 inches)
■ DIE IDENTIFICATION      M14C04KA_R
■ DIE SIZE (X x Y)              1465 x 1585 µm
■ SCRIBE LINE                   101.6 x 101.6 µm
■ PAD OPENING                100 x 100 µm

DIE LAYOUT
■ DI                               Die Identification (at the position shown in Figure 1)
■ C1, C2, C3, C5, C7    Pad contacts to the ISO pins (at the positions shown in Figure 1)
■ C4, C6, C8                 These ISO pins do not appear on the M14C04 die
■ NC                              This pad, shown in Figure 1, is Not Connected

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm).