HS3DB(V_A06) 数据手册 ( 数据表 ) - TSC Corporation

Features
✧ Glass passivated junction chip.
✧ For surface mounted application
✧ Low forward voltage drop
✧ Low profile package
✧ Built-in stain relief, ideal for automatic
   placement
✧ Fast switching for high efficiency
✧ High temperature soldering:
   260°C/10 seconds at terminals
✧ Plastic material used carries Underwriters
   Laboratory Classification 94V0

Mechanical Data
✧ Cases: Molded plastic
✧ Terminals: Pure tin plated, lead free
✧ Polarity: Indicated by cathode band
✧ Packing: 16mm tape per EIA STD RS-481
✧ Weight: 0.21 gram