ES2BA(V_F11) 数据手册 ( 数据表 ) - TSC Corporation

Features
✧ Glass passivated junction chip
✧ For surface mounted application
✧ Low profile package
✧ Built-in strain rellef
✧ Ideal for automated placement
✧ Easy pick and place
✧ Super fast recovery time for high efficiency
✧ Glass passivated chip junction
✧ High temperature soldering:
   260℃ /10 seconds at terminals
✧ Plastic material used carries Underwriters
   Laboratory Classification 94V-0
✧ Green compound with suffix "G" on packing
   code & prefix "G" on datecode

Mechanical Data
✧ Cases: Molded plastic
✧ Terminals: Pure tin plated, lead free
✧ Polarity: Indicated by cathode band
✧ Packing: 12mm tape per EIA STD RS-481
✧ Weight: 0.064 grams