EMIF03-SIM02F1 数据手册 ( 数据表 ) - STMicroelectronics

DESCRIPTION
The EMIF03-SIM02F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interfer ence. The EMIF03 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV.

BenefitS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free package
■ Very low PCB space consuming:  1.42mm x 1.42mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through integration & wafer level packaging.

MAIN PRODUCT APPLICATIONS:
EMI filtering and ESD protection for:
■ SIM Interface (Subscriber Identify Module)
■ UIM Interface (Universal Identify Module)