EMIF02-SPK02F2 数据手册 ( 数据表 ) - STMicroelectronics

Description
The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. Thats why the EMIF02-SPK02F2 is a very small device.
Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

FEATUREs
■ Packaged in lead-free Flip Chip
■ Very low resistance: 0.35 Ω
■ High attenuation: -45 dB at 900 MHz
■ Very low PCB space consumption: 0.89 mm x 1.26 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression IEC6 1000-4-2 level 4
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through integration and wafer level packaging

APPLICATION
■ Mobile phones