DFR1M 数据手册 ( 数据表 ) - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● For surface mounted application
● Glass passivated chip
● Low-profile package
● Ideal for automate placement
● Low power loss, high efficiency
● High temperature soldering 260°C/10 second at terminals

Mechanical Data
● Case: JEDEC DO-219-AB(SMF) Plastic case
● Polarity: color band denotes cathode end
● Packaging: 12mm tape per ELA STD RS-481
● Weight: approx 15mg