CS10L100CT 数据手册 ( 数据表 ) - Chip Integration Technology Corporation
生产厂家

Chip Integration Technology Corporation
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : JEDEC TO-220AB molded plastic body.
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026.
• Polarity: As marked.
• Mounting Position : Any.
• Weight : Approximated 2.25 gram.
10A Low Barrier Diode
Chip Integration Technology Corporation
10A Low Barrier Diode
Chip Integration Technology Corporation
10A Low Barrier Diode
Chip Integration Technology Corporation
10A Low Barrier Diode
Chip Integration Technology Corporation
10A Trench Low Barrier Diode
Chip Integration Technology Corporation
10A Trench Low Barrier Diode
Chip Integration Technology Corporation
10A Surface Mount Super Low Barrier Diode
Chip Integration Technology Corporation
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