CPDQR3V3R-HF 数据手册 ( 数据表 ) - ComChip

Features
- Bi-directional ESD protection.
- Surface mount package.
- Ultra small SMD package:0402.
- High component density.

Mechanical data
- Case: 0402/SOD-923 standard package, molded plastic.
- Terminals: Gold plated, solderable per MIL-STD-750,method 2026.
- Marking Code: E3
- Mounting position: Any.
- Weight: 0.001 gram(approx.).