CDSX400B(V2) 数据手册 ( 数据表 ) - ComChip

High Speed

FEATUREs
   Designed for mounting on small surface.
   Extremely thin/leadless package.
   Low leakage current.
   High mounting capability, strong surge
      withstand, high reliability.

Mechanical data
   Case: SOD-923 standard package, molded plastic.
   Terminals: solderable per MIL-STD-750 method 2026.
   Polarity: Indicated by cathode band.
   Mounting position: Any