STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Electrical characteristics
5.3.9
Memory characteristics
Flash memory
The characteristics are given at TA = –40 to 105 °C unless otherwise specified.
Symbol
Table 27. Flash memory characteristics
Parameter
Conditions
Min(1) Typ Max(1) Unit
tprog 16-bit programming time
TA = –40 to +105 °C
40 52.5 70
µs
tERASE Page (1 KB) erase time
TA = –40 to +105 °C
20
-
40 ms
tME
Mass erase time
TA = –40 to +105 °C
20
-
40 ms
Read mode
fHCLK = 24 MHz, VDD = 3.3 V
-
-
20 mA
IDD
Supply current
Write / Erase modes
fHCLK = 24 MHz, VDD = 3.3 V
-
-
5
mA
Power-down mode / Halt,
VDD = 3.0 to 3.6 V
-
-
50 µA
Vprog Programming voltage
-
2
-
3.6
V
1. Guaranteed by design.
Table 28. Flash memory endurance and data retention
Symbol Parameter
Conditions
Value
Min(1) Typ Max
Unit
NEND Endurance
TA = –40 to +85 °C (6 suffix versions)
TA = –40 to +105 °C (7 suffix versions)
10
-
1 kcycle(2) at TA = 85 °C
30
-
tRET Data retention 1 kcycle(2) at TA = 105 °C
10
-
10 kcycles(2) at TA = 55 °C
20
-
1. Based on characterization not tested in production.
2. Cycling performed over the whole temperature range.
- kcycles
-
- Years
-
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