ST7PMC2N6B6(2004) 查看數據表（PDF） - STMicroelectronics
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产品描述 (功能)
生产厂家
ST7PMC2N6B6
(Rev.:2004)
(Rev.:2004)
STMicroelectronics
ST7PMC2N6B6 Datasheet PDF : 294 Pages
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ST7MC1/ST7MC2
12.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only as design guidelines.
Figure 162. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250
200
150
Temp. [°C]
100
50
80°C
PREHEATING
PHASE
5 sec
SOLDERING
PHASE
COOLING PHASE
(ROOM TEMPERATURE)
0
Time [sec]
20
40
60
80
100
120
140
160
Figure 163. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
200
150
Temp. [°C]
100
50
90 sec at 125°C
ramp up
2°C/sec for 50sec
Tmax=220+/-5°C
for 25 sec
150 sec above 183°C
ramp down natural
2°C/sec max
0
100
200
300
Time [sec]
400
Recommended glue for SMD plastic packages dedicated to molding compound with silicone:
s Heraeus: PD945, PD955
s Loctite: 3615, 3298
283/294
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