ST7PMC2N6B6(2004) 查看數據表（PDF） - STMicroelectronics

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ST7PMC2N6B6
(Rev.:2004)

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, BRUSHLESS MOTOR CONTROL, FIVE TIMERS, SPI, LINSCI™

STMicroelectronics 

ST7MC1/ST7MC2

PACKAGE CHARACTERISTICS (Cont’d)

12.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

TQFP80 14x14

TQFP64 14x14

TQFP44 10x10

TQFP32 7x7

SDIP32 400mil

SDIP56 600mil

Power dissipation 1)

Maximum junction temperature 2)

Value

55

55

68

80

63

45

500

150

Unit

°C/W

mW

°C

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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