1SS133M(V_A07) 데이터시트 - TSC Corporation

Features
◇ Fast switching device(TRR<4.0nS)
◇ DO-34 package (JEDEC DO-204)
◇ Through-hole device type mounting
◇ Hermetically sealed glass
◇ Compression bonded construction
◇ All external surfaces are corrosion resistant and leads are readily solderable
◇ RoHS compliant
◇ Solder hot dip Tin (Sn) lead finish
◇ Cathode indicated by polarity band