RS3JF データシート - Shanghai Leiditech Electronic Technology Co., Ltd

FEATURES
• For surface mounted applications
• Low profile package
• Glass Passivated Chip Junction
• Easy to pick and place
• Fast reverse recovery time
• Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 27mg / 0.00095oz