ES1C データシート - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● Low profile space
● Ideal for automated placement
● Glass passivated chip junctions
● Low forward voltage drop
● Low leakage current
● High forward surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date
● Case: SOD-123FL molded plastic
   body over glass passivated chip
● Terminals: Solder plated, solderable per
   JESD22-B102
● Polarity: Laser band denotes cathode end
● Weight: 0.017gram