SS68C Hoja de datos - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● Low profile package
● Ultrafast reverse recovery time
● Low power losses, high efficiency
● Low forward voltage drop
● High surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● Component in accordance to
   RoHS 2011/65/EU and WEEE 2002/96/EC

Mechanical Date
● Case:SMC
   Molding compound meets
   UL 94 V-0 flammability rating
● Terminals: Solder plated, solderable per
   MIL-STD-750， Method 2026
● Polarity:Laser band denotes cathode end