US2MBF Datasheet - Gaomi Xinghe Electronics Co., Ltd.

Features
• Glass Passivated Die Construction
• Diffused Junction
• Ultra-Fast Recovery Time for High Efficiency
• Low Forward Voltage Drop, High Current
   Capability, and Low Power Loss
• Surge Overload Rating to 30A Peak
• Ideally Suited for Automated Assembly
• Plastic Material: UL Flammability
   Classification Rating 94V-0

MECHANICAL DATA
• Case: SMBF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 57mg / 0.002oz