TPMSC39A Datasheet - General Semiconductor
MFG CO.

General Semiconductor
Breakdown Voltage 6.8 to 43V Peak Pulse Power 1500W
FEATUREs
• Designed for under the hood surface mount applications
• Plastic package has Underwriters Laboratory Flammability Classification 94V-0
• Easy pick and place
• Low profile package
• Built-in strain relief
• Ideal for automated placement
• Exclusive patented PAR® oxide passivated chip construction
• 1500W peak pulse power capability with a 10/1000ms waveform, repetition rate (duty cycle): 0.01%
• Excellent clamping capability
• Low incremental surge resistance
• Very fast response time
• For devices with V(BR) ≥ 10V ID are typically less than 1.0mA at TA = 150°C
• High temperature soldering: 250°C/10 seconds at terminals
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