TPCM7000 Datasheet - Laird Tech Smart Technology

PRODUCT DESCRIPTION
   Tpcm™ 7000 is newest in Laird’s line of high-performance TIM product offerings. With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm. Coupled with superior wetting of the mating surfaces and displacing air, Tpcm™ 7000 provides industry leading lowest thermal resistance.

FEATURES & BENEFITS
• 7.5 W/mK bulk thermal conductivity
• Non silicone formulation that provides naturally
   tacky surface
• Fully characterized long term reliability
• No pump out
• Environmentally friendly solution that meets
   regulatory requirements including RoHS and
   REACH
• Easy rework

MARKETS
• Graphics Card
• Desktops
• Servers
• IGBTs
• Automotive
• Memory Modules
• Game Consoles