Part Name
TFMAJ13C
Description
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no available.
PDF
page
4 Pages
File Size
983.9 kB
MFG CO.
Rectron Semiconductor
TFMAJ13C Datasheet - Rectron Semiconductor
Rectron Semiconductor
FEATURES
* Plastic package has underwriters laboratory
* Glass passivated chip construction
* 400 watt surage capability at 1ms
* Excellent clamping capability
* Low zener impedance
* Fast response time
Part Name
Description
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MFG CO.
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