STDELIV Datasheet - STMicroelectronics

INTRODUCTION
The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product:
– micromodules,
– flat packages,
– wafers.

■ MICROMODULES
    Dedicated package for Smartcard products, the micromodule type depends on the size of the product and on the application.
    Table 1 lists all available micromodules.

■ FLAT PACKAGES
    For applications which require surface mount technology, suitable for PC cards, or other security modules, STMicroelectronics offers flat packages listed In Table 2.

■ WAFERS
    For issuer production need, ST offers sawn and unsawn wafers deliveries, listed in Table 3.