SS32C Datasheet - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● Low profile package
● Ideal for automated placement
● Low power losses, high efficiency
● Low forward voltage drop
● High surge capability
● High temperature soldering：
   260℃/10 seconds at terminals

Mechanical Date
● Case: JEDEC DO-214AB molded plastic
● Terminals: Solder plated, solderable per
   JESD22-B102D
● Polarity: Laser band denotes cathode end