SM1K6VCF Datasheet - Shanghai Leiditech Electronic Technology Co., Ltd

FEATURES:
✧ Excellent clamping capability.
✧ Low profile package and low inductance.
✧ High peak pulse voltage capability on 1.2/50μs-8/20μs@2Ω waveform.
✧ Fast response time: typically less than 1.0ps from 0V to VBR min.
✧ High temperature soldering: 260℃/40s at terminals.
✧ Plastic package has underwriters laboratory flammability 94V-0.
✧ For surface mounted applications in order to optimize board space.