S3AB(Ver_B07) Datasheet - TSC Corporation
MFG CO.
TSC Corporation
Features
◇ For surface mounted application
◇ Glass passivated junction chip.
◇ Low forward voltage drop
◇ High current capability
◇ Easy pick and place
◇ High surge current capability
◇ Plastic material used carries Underwriters
Laboratory Classification 94V-0
◇ High temperature soldering:
◇ 260°C / 10 seconds at terminals
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Description
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