S1MBF-PJ Datasheet - Dongguan Pingjingsemi Technology Co., Ltd,

FEATURES
✦ For surface mount applications
✦ Glass passivated chip junction
✦ Low profile package
✦ Easy to pick and place
✦ Lead free in comply with EU RoHS2011/65/EU directives

MECHANICAL DATA
✦ Case: SMBF molded plastic body
✦ Terminals: Solderable per MIL-STD-750， Method 2026
✦ Weight: Approximated 0.057 grams