S-M1 Datasheet - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● Low profile space
● Ideal for automated placement
● Glass passivated chip junctions
● Low forward voltage drop
● Low leakage current
● High forward surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● AEC-Q101 qualified

Mechanical Date
● Case: JEDEC DO-214AC molded plastic
   body over glass passivated chip
● Terminals: Solder plated, solderable per
   JESD22-B102
● Polarity: Laser band denotes cathode end