PI3033B Datasheet - AMI Semiconductor

Description:
Peripheral Imaging Corporation PI3033B CIS, Contact Image Sensor, chip is a 200 dot per inch resolution, linear array image sensor chip. The sensor chip is processed with PIC’s proprietary CMOS Image Sensing Technology. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB) in varying sensing array lengths. Accordingly offering image reading widths to suit document scanners found in facsimile, scanner, check reader, and office automation equipment.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing switches, buffers, and a chip selector. The detectors elementto-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad symbols and functions are described in Table 1.