Part Name
NTMFSC4D2N10MC
Other PDF
PDF
page
7 Pages
File Size
366.2 kB
MFG CO.

ON Semiconductor
Features
• Advanced Dual−Sided Cooled Packaging
• Ultra Low RDS(on) to Minimize Conduction Losses
• MSL1 Robust Packaging Design
• 175°C TJ Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Orring FET/Load Switching
• Synchronous Rectifier
• DC−DC Conversion