NTMFSC2D9N08H Datasheet - ON Semiconductor

Features
• Advanced Dual−Side Cooled Packaging
• Ultra Low RDS(on) to Minimize Conduction Losses
• MSL1 Robust Packaging Design
• Low Qg and Qoss to Minimize Charge Losses
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
   Compliant

Typical Applications
• DC−DC Conversion
• Orring FET/Load Switching
• Synchronous Rectification