MMSZ5260 Datasheet - Shanghai Leiditech Electronic Technology Co., Ltd

Features
● For surface mounted applications
   in order to optimize board space
● Low profile space
● Glass passivated chip
● High reliability
● For use in stabilizing and clipping
   circuits with high power rating
● Component in accordance to
   RoHS 2002/95/EC and WEEE 2002/96/EC

APPLICATIONs
● Voltage stabilization

Mechanical Date
● Case: JEDEC SOD-123FL molded plastic
   body over glass passivated chip
● Terminals: Solder plated, solderable per
   MIL-STD-750 Method 2026
● Polarity: types the band by laser
   denotes the cathode
● Weight: 0.017gram