MC9S08JS16(2014) Datasheet - NXP Semiconductors.

Addendum for New QFN Package Migration

   This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See the table below for the old (gold wire) package    versus the new (copper wire) package.

   To view the new drawing, go to Freescale.com and search on the new 98A package number for your device.
   For more information about QFN package use, see EB806: Electrical Connection Recommendations for the Exposed Pad on QFN and DFN Packages.