EMIF02-USB03F2(2008) Datasheet - STMicroelectronics

Description
The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go).
The EMIF02-USB03F2 Flip Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts.

FEATUREs
■ 2-line low-pass-filter + 2-line ESD protection
■ High efficiency in EMI filtering
■ Lead-free package
■ Very low PCB space occupation: < 3.25 mm2
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression (IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
■ integration and wafer level packaging

APPLICATION
ESD protection and EMI filtering for:
■ USB OTG port