EMIF02-MIC03F2(2014) Datasheet - STMicroelectronics

Description
The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.
This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

FEATUREs
• EMI symmetrical (I/O) low-pass filter
• High efficiency in EMI filtering
• Very low PCB space consuming: 1.07 mm x 1.47 mm
• Very thin package: 0.65 mm
• High efficiency in ESD suppression
• High reliability offered by monolithic integration
• High reducing of parasitic elements through integration and wafer level packaging

APPLICATION
• Mobile phones (differential microphone filtering and ESD protection).