DB1010 Datasheet - DIOTEC Electronics Corporation

FEATURES
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
● SURGE OVERLOAD RATING TO 400 AMPS PEAK
● UL RECOGNIZED - FILE #E124962
● RoHS COMPLIANT

MECHANICAL DATA
   Case: Molded Epoxy (UL Flammability Rating 94V-0)
   Terminals: Round silver plated copper pins
   Soldering: Per MIL-STD 202 Method 208 guaranteed
   Polarity: Marked on side of case; positive lead at beveled corner
   Mounting Position: Any.  Through hole provided for #6 screw
   Weight: 0.18 Ounces (5.4 Grams)