CS30L60CTG-A Datasheet - Chip Integration Technology Corporation
MFG CO.

Chip Integration Technology Corporation
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Halogen-free part
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : JEDEC TO-220AB molded plastic body.
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026.
• Polarity: As marked.
• Mounting Position : Any.
• Weight : Approximated 2.25 gram.
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