CPDUR9V0LP-HF(RevA) Datasheet - ComChip

Features
- Bi-directional ESD protection.
- Surface mount package.
- High component density.
- Low leakage current.

Mechanical data
- Case: 0603/SOD-523F standard package, molded plastic.
- Terminals: Gold plated, solderable per MIL-STD-750,method 2026.
- Marking Code: E9P
- Mounting position: Any.
- Weight: 0.003 gram(approx.).