Part Name
CDSU4148
Description
Other PDF
PDF
page
4 Pages
File Size
117.5 kB
MFG CO.

ComChip
Features
- High Speed
- Designed for mounting on small surface.
- Extremely thin/leadless package.
- High mounting capability, strong surge withstand, high reliability.
Mechanical data
- Case: 0603/SOD-523F standard package, molded plastic.
- Terminals: Gold plated, solderable per MIL-STD-750, method 2026.
- Polarity: Indicated by cathode band.
- Mounting position: Any.
- Weight: 0.003 gram (approx.).