CDSF355B Datasheet - ComChip

High Speed 

FEATUREs
   Designed for mounting on small surface.
   Extremely thin/leadless package.
   Low leakage current.
   High mounting capability, strong surge   
   withstand, high reliability.

Mechanical data
   Case: 1005(2512) standard package, molded plastic.
   Terminals:  Gold plated, solderable per MIL-STD-750,method 2026.
   Polarity: Indicated by cathode band.
   Mounting position: Any
   Weight: 0.006 gram(approx.).