Part Name
BZX85C
Description
Other PDF
no available.
PDF
page
3 Pages
File Size
1.6 MB
MFG CO.
Unspecified1
BZX85C Datasheet - Unspecified1
Unspecified1
[Diotech Company.]
FEATURES
• Low profile package
• Built-in strain relief
• Low inductance
• High temperature soldering : 260°C /10 seconds at terminals
• Glass package hasUnderwriters Laboratory Flammability Classification
• In compliance with EU RoHS 2002/95/EC directives
Part Name
Description
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MFG CO.
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