Part Name
BAS116RF
Description
Other PDF
PDF
page
2 Pages
File Size
61.3 kB
MFG CO.

TSC Corporation
Features
◇ Low power loss, high current capability, low VF
◇ Surface device type mounting
◇ Moisture sensitivity level 1
◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate
◇ Pb free version and RoHS compliant
◇ Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
Mechanical Data
◇ Case : SOT- 23 small outline plastic package
◇ Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
◇ High temperature soldering guaranteed: 260°C/10s
◇ Weight : 0.008gram (approximately)