3EZ6.2D5 Datasheet - Secos Corporation.
MFG CO.
Secos Corporation.
FEATURES
• Glass Passivated Chip
• Low Leakage
• Built-in Strain Relief
• Low Inductance
• High Peak Reverse Power Dissipation
• For Use in Stabilizing and Clipping Circuits with High Power Rating
Part Name
Description
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