Part Name
1SS133M
Other PDF
PDF
page
2 Pages
File Size
77.5 kB
MFG CO.
TSC Corporation
1SS133M(V_A07) Datasheet - TSC Corporation
TSC Corporation
Features
◇ Fast switching device(TRR<4.0nS)
◇ DO-34 package (JEDEC DO-204)
◇ Through-hole device type mounting
◇ Hermetically sealed glass
◇ Compression bonded construction
◇ All external surfaces are corrosion resistant and leads are readily solderable
◇ RoHS compliant
◇ Solder hot dip Tin (Sn) lead finish
◇ Cathode indicated by polarity band
Part Name
Description
View
MFG CO.
Hermetically Sealed Glass Fast Switching Schottky Barrier Diode ( Rev : V_C14 )
TSC Corporation
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