
STM32F301x6 STM32F301x8
Package characteristics
Table 74. WLCSP49 wafer level chip size package mechanical data(1)
Symbol
millimeters
Min
Typ
Max
inches
Min
Typ
Max
A
A1
A2
A3(2)
b(3)
D
E
e
e1
e2
F
G
aaa
bbb
ccc
ddd
eee
N
0.525
-
-
-
0.220
3.382
3.116
-
-
-
-
-
-
-
-
-
-
0.555
0.175
0.380
0.025
0.250
3.417
3.151
0.400
2.400
2.400
0.508
0.375
0.100
0.100
0.100
0.050
0.050
0.585
0.0207
-
-
-
-
-
-
0.280
0.0087
3.452
0.1331
3.186
0.1227
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Number of pins
49
0.0219
0.0069
0.0150
0.0010
0.0098
0.1345
0.1241
0.0157
0.0945
0.0945
0.200
0.148
1.9291
0.0039
0.0039
0.0020
0.0020
0.0230
-
-
-
0.0110
0.1359
0.1254
-
-
-
-
-
-
-
-
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
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