STM32F301C6T6TR(2014) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
STM32F301C6T6TR
(Rev.:2014)
(Rev.:2014)
STMicroelectronics
STM32F301C6T6TR Datasheet PDF : 132 Pages
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Package characteristics
STM32F301x6 STM32F301x8
Figure 35. WLCSP49 wafer level chip size package
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1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
2. Bump position designation per JESD 95-1, SPP-010.
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